MODULE PART

摘要

A low-profile module part having an adequate shield effect. Mounting parts (30) composed of electronic parts are mounted on a circuit substrate (10), and the mounting parts (30) are encapsulated with an encapsulant (40). A metal film (20) is formed on the surface of this encapsulant (40). A ground pattern (50) is formed along the periphery of the surface of the circuit substrate (10), thereby electrically connecting the metal film (20) and the ground pattern (50).