Process for detachably mounting a semiconductor substrate to be processed on a supporting wafer used in the production of semiconductor components comprises thinly grinding the substrate and removing the substrate from the wafer

摘要

Process for detachably mounting a semiconductor substrate (3) to be processed on a supporting wafer (1) comprises thinly grinding the substrate and removing the substrate from the wafer. The wafer is connected to the substrate or detached from it by applying a direct voltage.