| 摘要 |
PURPOSE: A press apparatus for fabricating a semiconductor device is provided to lower the height of equipment and reduce the vibration and the noise by simplifying an upper structure of the equipment. CONSTITUTION: A press apparatus for fabricating a semiconductor device includes a main frame(100,100'), a lower mold(103), an upper mold(104), and an elevation unit. The lower mold(103) is installed at the main frame(100,100'). The upper mold(104) is installed at an upper side of the lower mold. The upper mold(104) is elevated by using an elevation bar(102). The elevation unit includes a motor, a crank device(120), a selection connection unit, and air-pressure cylinder. The motor is installed at one side of the main frame. The crank device includes a crank shaft(121) and a connecting rod(123). The selective connection unit is installed at a lower part of the elevation bar in order to connect or separate the connecting rod(123) to or from the elevation bar(102). The air-pressure cylinder is connected to a lower side of the elevation bar in order to elevate the elevation bar.
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