| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet usable in a production process of a semiconductor device at least for sealing a semiconductor element connected to a conductor on an adhesive layer with a sealing resin in the adhesive sheet having a base layer and the adhesive layer, manifesting excellent heat resistance, and having a nonsilicone adhesive layer with good releasability from the semiconductor device after finishing the production process. <P>SOLUTION: The adhesive layer of the adhesive sheet contains a block copolymer having an aromatic vinyl compound polymer block and a conjugated dienic compound polymer block, and/or a hydrogenated product thereof, and is crosslinked so as to have ≥50 wt.% gel fraction. <P>COPYRIGHT: (C)2004,JPO |
