| 发明名称 |
PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND METHOD FOR MOUNTING ELECTRONIC COMPONENT |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To restrain increase of thickness when an electronic component is mounted on a printed circuit board. <P>SOLUTION: A molded package 4 is mounted in a recessed part 2 in such a manner that a lead terminal 5 protruded from the molded package 4 is in contact with a wiring pattern 3 formed on a surface of the printed circuit board 1, and the lead terminal 5 and the wiring pattern 3 are connected by using solder. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2004079666(A) |
申请公布日期 |
2004.03.11 |
| 申请号 |
JP20020235633 |
申请日期 |
2002.08.13 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
KONDO MANABU |
| 分类号 |
H05K1/18;H01L21/60;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/18 |
| 代理机构 |
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