MATERIAL FOR MULTILAYER PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD USING IT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is economically excellent and a material for the multilayer printed wiring board. SOLUTION: A circuit sheet which can be laminated in a lump is manufactured by forming a circuit by etching a metallic foil of a sheet of a semi-hardening thermosetting resin material having the metallic foil, and by providing a hole in the sheet and charging it with a conductive material. Thereafter, a multilayer printed wiring board is obtained by laminating a plurality of circuit sheets in a lump. COPYRIGHT: (C)2004,JPO