发明名称 Heat-sensitive adhesive material
摘要 A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1<E2 where E1 is heat energy to fuse the solid plasticizer; and E2 is heat energy to fuse the heat-fusible substance.
申请公布号 EP1396528(A1) 申请公布日期 2004.03.10
申请号 EP20020019444 申请日期 2002.08.30
申请人 RICOH COMPANY, LTD. 发明人 KUGO, TOMOYUKI;IKEDA, TOSHIAKI
分类号 C09J7/02;C09J11/08;C09J201/00 主分类号 C09J7/02
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