发明名称 |
Heat-sensitive adhesive material |
摘要 |
A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1<E2 where E1 is heat energy to fuse the solid plasticizer; and E2 is heat energy to fuse the heat-fusible substance. |
申请公布号 |
EP1396528(A1) |
申请公布日期 |
2004.03.10 |
申请号 |
EP20020019444 |
申请日期 |
2002.08.30 |
申请人 |
RICOH COMPANY, LTD. |
发明人 |
KUGO, TOMOYUKI;IKEDA, TOSHIAKI |
分类号 |
C09J7/02;C09J11/08;C09J201/00 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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