发明名称 |
Method for polishing angular substrates |
摘要 |
An angular substrate polishing method includes the steps of holding an angular substrate having a surface to be polished within a guide ring of a substrate holding head; pressing the substrate surface to be polished, and also one surface of the guide ring, against a polishing pad; and independently rotating the polishing pad and the substrate-holding head together with the substrate it holds while pressing the polishing pad-contacting surface of the guide ring against the polishing pad, to thereby polish the substrate surface. During the polishing step, a pressing force is applied to the guide ring which is separate from the pressing force applied to the substrate, enhancing the flatness of the polished substrate. |
申请公布号 |
EP1283090(A3) |
申请公布日期 |
2004.03.10 |
申请号 |
EP20020255563 |
申请日期 |
2002.08.08 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
MORIYA, JIRO;WATANABE, MASATAKA;OKAZAKI, SATOSHI;OZAWA, HIDEKAZU;ISHII, YOU;KOJIMA, SHUNICHIRO |
分类号 |
B24B7/24;B24B37/005;B24B37/04;B24B37/30 |
主分类号 |
B24B7/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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