发明名称
摘要 A method for fabricating a dual metal gate structure for a semiconductor device including deposition of a semiconductor substrate having PMOS and NMOS regions, a first gate having a first insulating layer and a first metal layer is formed in a first region. The first region is either the PMOS or NMOS region, and the remaining region becomes a second region. A dummy gate is formed in the second region. A spacer and a source/drain region are formed for each of the first and dummy gates. The dummy gate, however, is removed to expose a portion of the substrate in the second region. A second gate constructed of a second gate insulating layer and a second metal layer is then formed on the exposed portion of the substrate in the second region.
申请公布号 KR100422342(B1) 申请公布日期 2004.03.10
申请号 KR20000085605 申请日期 2000.12.29
申请人 发明人
分类号 H01L21/336;H01L29/43;H01L21/8238;H01L27/092;H01L29/423;H01L29/49 主分类号 H01L21/336
代理机构 代理人
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