发明名称 |
Electronic device substrate structure and electronic device |
摘要 |
An electronic device substrate structure including a substrate 2, a metal thin film 4 as a (111)-oriented film of a face-centered cubic structure or as a (0001)-oriented film of a hexagonal closest packed structure formed on the substrate 2, and a wurtzite type thin film 5 as a (0001)-oriented film of a wurtzite crystal structure formed on the metal thin film 4, wherein: each of the two thin films is a polycrystalline film containing at least two kinds of crystal grains different in direction of crystal orientation in the plane; when the metal thin film 4 is a (111)-oriented film, <11-20> axes in the plane of the wurtzite type thin film 5 are parallel to <1-10> axes in the plane of the metal thin film 4; and when the metal thin film 4 is a (0001)-oriented film, <11-20> axes in the plane of the wurtzite type thin film 5 are parallel to <11-20> axes in the plane of the metal thin film 4. <IMAGE> |
申请公布号 |
EP1396889(A2) |
申请公布日期 |
2004.03.10 |
申请号 |
EP20030019853 |
申请日期 |
2003.09.01 |
申请人 |
TDK CORPORATION |
发明人 |
NOGUCHI, TAKAO;SAITOU, HISATOSHI;ABE, HIDENORI;YAMASHITA, YOSHINARI |
分类号 |
C30B29/68;H01L21/20;H01L21/285;H01L21/3205;H01L21/365;H01L29/04;H01L41/08;H01L41/09;H01L41/18;H01L41/22;H01L41/29;H01L41/316;H01L41/319;H01L41/39;H03H3/02;H03H9/17 |
主分类号 |
C30B29/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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