发明名称 |
Semiconductor device and optical device using the same |
摘要 |
A semiconductor device comprising a semiconductor element and a support member having a recess for housing the semiconductor element is disclosed. The support member includes lead electrodes and a support part holding the lead electrodes so that a surface of tip portions of the lead electrodes are exposed in a bottom of the recess. A main surface of the support member has at least a first main surface disposed adjacent to the recess and a second main surface disposed adjacent to the first main surface. The second main surface preferably has a protrusion and a further recess. The protrusion preferably forms an outer wall around a depression. The semiconductor device having this configuration has excellent and accurate positioning and can be strongly bonded with other members. The semiconductor device can also be obtained with a high process yield. |
申请公布号 |
EP1396891(A2) |
申请公布日期 |
2004.03.10 |
申请号 |
EP20030019596 |
申请日期 |
2003.09.03 |
申请人 |
NICHIA CORPORATION |
发明人 |
ASAKAWA, HIDEO |
分类号 |
H01L31/0203;H01L33/20;H01L33/48;H01L33/58;H01L33/62 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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