发明名称 |
Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip |
摘要 |
A semiconductor device (10) includes connector leads (12) which have an offset portion (12C) supported by the primary surface (11A) of a semiconductor chip (11) on which electronics circuitry is formed into an integrated circuit. The offset portion (12C) is disposed near the contact pads (13) for connecting the electronics circuitry. The remaining portion (12A) of the connector leads (12) far from the contact pads (13) is spaced from the primary surface (11A) by an adhesive strip (15) of electrically insulative material. Bonding wires (16) connect the connector leads (12) to the contact pads (13). The total thickness (T) of the pakcage (18) is reduced to accomplish a thinner and flatter semiconductor device (10). |
申请公布号 |
EP1396886(A2) |
申请公布日期 |
2004.03.10 |
申请号 |
EP20030027952 |
申请日期 |
1996.06.18 |
申请人 |
OKI ELECTRIC INDUSTRY COMPANY, LIMITED |
发明人 |
YAMADA, ETSUO |
分类号 |
H01L23/31;H01L23/495 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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