发明名称 |
LASER DEVICE FOR CUTTING BRITTLE MATERIAL AND METHOD FOR CUTTING BRITTLE MATERIAL BY USING THE SAME |
摘要 |
PURPOSE: A laser device for cutting a brittle material and a method for cutting the brittle material by using the same are provided to precisely cut the brittle material by optimizing a radiation intensity profile of a laser beam section without melting the brittle material. CONSTITUTION: A laser device includes a laser generating section(30) for radiating a laser beam. The laser radiated from the laser generating section(30) is divided into at least two parts by means of a beam splitter(32). A beam intensity adjusting section(34) is provided to adjust output intensity of the laser beam passing through the beam splitter(32). Beam deformation sections(36a,36b) are provided to deform a size and a shape of the laser beam. Reflective mirror sections(38b,38c) are provided to move the position of the laser beam radiated onto a brattle material. A cooler sprays coolant(42) onto the brittle material. |
申请公布号 |
KR20040020605(A) |
申请公布日期 |
2004.03.09 |
申请号 |
KR20020052240 |
申请日期 |
2002.08.31 |
申请人 |
ESSEL-TECH CO., LTD. |
发明人 |
JUNG, JAE YONG;LEE, SEOK JUN |
分类号 |
B23K26/36;B23K26/38;(IPC1-7):B23K26/38 |
主分类号 |
B23K26/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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