发明名称 LASER DEVICE FOR CUTTING BRITTLE MATERIAL AND METHOD FOR CUTTING BRITTLE MATERIAL BY USING THE SAME
摘要 PURPOSE: A laser device for cutting a brittle material and a method for cutting the brittle material by using the same are provided to precisely cut the brittle material by optimizing a radiation intensity profile of a laser beam section without melting the brittle material. CONSTITUTION: A laser device includes a laser generating section(30) for radiating a laser beam. The laser radiated from the laser generating section(30) is divided into at least two parts by means of a beam splitter(32). A beam intensity adjusting section(34) is provided to adjust output intensity of the laser beam passing through the beam splitter(32). Beam deformation sections(36a,36b) are provided to deform a size and a shape of the laser beam. Reflective mirror sections(38b,38c) are provided to move the position of the laser beam radiated onto a brattle material. A cooler sprays coolant(42) onto the brittle material.
申请公布号 KR20040020605(A) 申请公布日期 2004.03.09
申请号 KR20020052240 申请日期 2002.08.31
申请人 ESSEL-TECH CO., LTD. 发明人 JUNG, JAE YONG;LEE, SEOK JUN
分类号 B23K26/36;B23K26/38;(IPC1-7):B23K26/38 主分类号 B23K26/36
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