| 发明名称 |
Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
| 摘要 |
A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
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| 申请公布号 |
US6702176(B2) |
申请公布日期 |
2004.03.09 |
| 申请号 |
US20010011808 |
申请日期 |
2001.12.11 |
| 申请人 |
NEC TOPPAN CIRCUIT SOLUTIONS, INC;SOLDER COAT CO., LTD. |
发明人 |
ITO TOSHIHIDE;HARA SHIRO |
| 分类号 |
H05K3/28;B23K35/12;B23K35/26;C22C13/00;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
H05K3/28 |
| 代理机构 |
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