发明名称 Method for forming crystalline silicon layer and crystalline silicon semiconductor device
摘要 A plurality of linear catalytic metal element portions are arranged at predetermined intervals just on or just beneath an amorphous silicon layer, and, in this state, the amorphous silicon layer is heat treated to crystallize the amorphous silicon layer and consequently to form a polycrystalline silicon layer. This construction can realize the provision of a method for the formation of an evenly oriented, high-quality crystalline silicon layer in a large area, and a crystalline silicon semiconductor device produced by this method.
申请公布号 US6703289(B2) 申请公布日期 2004.03.09
申请号 US20010007670 申请日期 2001.12.10
申请人 HITACHI CABLE, LTD. 发明人 MURAMATSU SHINICHI;MINAKAWA YASUSHI;OKA FUMIHITO;SASAKI TADASHI
分类号 C01B33/02;C23C16/24;C23C16/44;H01L21/20;H01L21/205;(IPC1-7):H01L21/20;H01L29/04 主分类号 C01B33/02
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