发明名称 IC socket contact medium having uniform contact force
摘要 An IC socket is provided which realizes a uniform pressure of contact with an IC package over the entire length of a row of contacts and thereby enables an appropriate evaluation of characteristics of the IC package. The IC socket mounted on a printed circuit board includes: a socket base having a large number of contacts arranged in a row and brought into contact with leads of an IC package; a cover bearing on the contacts through an elastic body; and fixing portions for securing the cover to the socket base; wherein a contact surface between the elastic body and the contacts is curved in a longitudinal direction and the curved surface is so shaped as to generate a uniform contact force between the contacts and the leads of the IC package.
申请公布号 US6702609(B2) 申请公布日期 2004.03.09
申请号 US20020212873 申请日期 2002.08.07
申请人 YAMAICHI ELECTRONICS CO., LTD. 发明人 SUZUKI KATSUMI;NAKAMURA YUJI
分类号 G01R31/26;G01R1/04;G01R1/073;H01R33/76;H05K7/10;(IPC1-7):H05K1/00;H05K7/00 主分类号 G01R31/26
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