发明名称 |
IC socket contact medium having uniform contact force |
摘要 |
An IC socket is provided which realizes a uniform pressure of contact with an IC package over the entire length of a row of contacts and thereby enables an appropriate evaluation of characteristics of the IC package. The IC socket mounted on a printed circuit board includes: a socket base having a large number of contacts arranged in a row and brought into contact with leads of an IC package; a cover bearing on the contacts through an elastic body; and fixing portions for securing the cover to the socket base; wherein a contact surface between the elastic body and the contacts is curved in a longitudinal direction and the curved surface is so shaped as to generate a uniform contact force between the contacts and the leads of the IC package.
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申请公布号 |
US6702609(B2) |
申请公布日期 |
2004.03.09 |
申请号 |
US20020212873 |
申请日期 |
2002.08.07 |
申请人 |
YAMAICHI ELECTRONICS CO., LTD. |
发明人 |
SUZUKI KATSUMI;NAKAMURA YUJI |
分类号 |
G01R31/26;G01R1/04;G01R1/073;H01R33/76;H05K7/10;(IPC1-7):H05K1/00;H05K7/00 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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