| 摘要 |
The invention relates to a test socket interposer. The interposer includes a flexible substrate with an upper signal contact and an upper ground contact on its top surface and a lower signal and a lower ground contact on its bottom surface. A portion of an upper surface of the upper signal contact is higher and to the right of an upper surface of the ground contact so that a signal contact of a device contacts the upper signal contact before a device ground slug contacts the upper ground contact. Also, a downward force exercised by the device signal contact causes pivoting of the upper signal contact and the substrate is sufficiently flexible to allow for this pivoting of the upper signal contact.
|
