发明名称 |
Stress reducing stiffener ring |
摘要 |
An electronic structure and associated method of formation. A laminate is solderably coupled to an electronic carrier. A stiffener is adhesively attached to a portion of a surface of the laminate by a stiffener adhesive that is in physically adhesive contact with a portion of a first surface of the stiffener and with the portion of the surface of the laminate. A thermal lid is adhesively attached to a portion of a second surface of the stiffener by a lid adhesive that is in physically adhesive contact with a portion of a surface of the lid and with a portion of the second surface of the stiffener. A void region is disposed between the surface of the thermal lid and the surface of the laminate.
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申请公布号 |
US6703704(B1) |
申请公布日期 |
2004.03.09 |
申请号 |
US20020254391 |
申请日期 |
2002.09.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALCOE DAVID J.;BLACKWELL KIM J.;JADHAV VIRENDRA R. |
分类号 |
B42D15/10;G06K19/077;H01L23/00;H01L23/10;H01L23/12;H01L23/16;H01L23/31;H01L23/36;(IPC1-7):H01L23/06 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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