发明名称 Electronic device having stacked modules and method for producing it
摘要 An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a stack have identical layouts, while chip select circuits which can be set irreversibly via contact areas are disposed on the chips, which chip select circuits enable an irreversible assignment of the contact areas to the stack intermediate planes.
申请公布号 US6703651(B2) 申请公布日期 2004.03.09
申请号 US20010948261 申请日期 2001.09.06
申请人 INFINEON TECHNOLOGIES AG 发明人 WOERZ ANDREAS;WENNEMUTH INGO
分类号 H01L25/18;H01L23/50;H01L23/52;H01L25/065;H01L25/07;(IPC1-7):H01L23/538 主分类号 H01L25/18
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