发明名称 |
Electronic device having stacked modules and method for producing it |
摘要 |
An electronic device having stacked modules and method for producing it are described. Each module has a chip. Each chip is mounted on a stack intermediate plane. The stack intermediate planes of a stack have identical layouts, while chip select circuits which can be set irreversibly via contact areas are disposed on the chips, which chip select circuits enable an irreversible assignment of the contact areas to the stack intermediate planes.
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申请公布号 |
US6703651(B2) |
申请公布日期 |
2004.03.09 |
申请号 |
US20010948261 |
申请日期 |
2001.09.06 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
WOERZ ANDREAS;WENNEMUTH INGO |
分类号 |
H01L25/18;H01L23/50;H01L23/52;H01L25/065;H01L25/07;(IPC1-7):H01L23/538 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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