发明名称 |
Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet |
摘要 |
The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
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申请公布号 |
US6703909(B2) |
申请公布日期 |
2004.03.09 |
申请号 |
US20010991648 |
申请日期 |
2001.11.26 |
申请人 |
TDK CORPORATION |
发明人 |
MIURA TARO;FUJISHIRO YOSHIKAZU |
分类号 |
H01L23/12;H01P1/162;H01P1/215;H01P3/02;H05K1/02;H05K9/00;(IPC1-7):H01P3/08 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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