发明名称 MASK FOR MANUFACTURING HIGH INTEGRATED CIRCUIT, LAYOUT FORMING METHOD THEREOF, MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING HIGH INTEGRATED CIRCUIT DEVICE USING THE SAME
摘要 PURPOSE: A mask for manufacturing a high integrated circuit, a layout forming method thereof, a manufacturing method thereof, and a method for manufacturing a high integrated circuit device using the same are provided to be capable of minimizing total line width of a metal line of the high integrated circuit device. CONSTITUTION: A mask set for manufacturing a high integrated circuit is provided with a pair of phase shift regions for defining an access metal line and an alternate type phase shift mask(20) formed at the upper portion of a transparent substrate for defining the pair of phase shift region. At this time, the alternate type phase shift mask includes the first opaque pattern. The mask set further includes the second opaque pattern formed at the upper portion of the transparent substrate for preventing the access metal line from being erased and a half tone phase shift trim mask(30) for defining a pass metal line connected with the access metal line.
申请公布号 KR20040019601(A) 申请公布日期 2004.03.06
申请号 KR20020051194 申请日期 2002.08.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, SU HAN;KIM, DONG HYEON;KIM, YU HYEON;PARK, CHEOL HONG;YOO, MUN HYEON
分类号 G03F1/30;G03F1/32;G03F1/68;G03F1/70;G03F7/20;H01L21/027 主分类号 G03F1/30
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