| 摘要 |
The present processing apparatus blocks off such a portion of a flow of a plating solution ( 17 ) that is other than a vicinity of a liquid surface, by using a first partition plate ( 15 ) whose lower end is in close contact with a bottom of a plating tank ( 11 ) and whose upper end is at a position lower than a liquid surface. Therefore, the plating solution ( 17 ) flowing at the bottom of the plating tank ( 11 ) flows upwards along the first partition plate ( 15 ). At this time, heavy foreign substances do not tend to follow such an upward movement of the plating solution ( 17 ), and therefore sink and accumulate in a vicinity of the lower end of the first partition plate ( 15 ), so as not to flow into a downstream side of the plate. With this arrangement, the present processing apparatus can remove the heavy foreign substances from the plating solution ( 17 ) without relying solely on a filter of a circulation pipe ( 10 ). |
