发明名称 APPARATUS AND METHOD FOR FILM-FORMING TREATMENT
摘要 PROBLEM TO BE SOLVED: To solve a problem that the prior arts compose an entire apparatus while including peripheral functions other than a film-forming function such as a load lock chamber or a substrate transfer chamber, and consequently that the whole apparatus becomes large, a facility cost increases, maintenance, model change and new model launching take much time, and flexibility to the production quantity is poor. SOLUTION: An apparatus for film-forming treatment has at least two groups of film-forming chambers 1 which can perform film-forming treatment simultaneously for several substrates 2 to be film-formed, wherein components in the film-forming chamber 1 are substantially similarly configured and arranged with respect to the substrates 2 to be film-formed; and further has at least one or more preliminary vacuum chambers 10 provided in an exhaust path leading to an exhaust means 11 for exhausting the air from the film-forming chamber 1. A small apparatus which can complete all processes of import, export, vacuum drawing and film-forming treatment in one unit, is realized by using the above apparatus for film-forming treatment. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004068091(A) 申请公布日期 2004.03.04
申请号 JP20020229780 申请日期 2002.08.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OKUDA EIJI;YAMADA OSAMU;IMOTO HIDEO;HATAYAMA TAKESHI;TANIDA TAKAHIKO;YAMASHITA HIROSHI
分类号 C23C16/50;C23C16/26;H01L21/285;(IPC1-7):C23C16/50 主分类号 C23C16/50
代理机构 代理人
主权项
地址