| 摘要 |
PROBLEM TO BE SOLVED: To provide a pusher-type plating apparatus for plating a printed circuit board or the like while making the thickness of a plated film uniform. SOLUTION: The plating apparatus 1 comprises a plating tank 11 filled with a plating liquid 10, several electrodes 12 longitudinally arranged in the plating tank 11, and a transferring means 15 for transferring the printed circuit board 13 of an article to be plated in an arranged direction Y of the electrodes 12. The plating apparatus 1 further comprises an adjustment means 16 for adjusting a relative position of the electrodes 12 with respect to the printed circuit board 13, and a control means 19 for moving and stopping the transferring means 15 with predetermined timing. COPYRIGHT: (C)2004,JPO
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