| 摘要 |
PROBLEM TO BE SOLVED: To provide a measuring apparatus for semiconductor circuit comprising an electrical connection means, which is formed on a chip region defined on the semiconductor wafer and copes with the changes in the position of an external connection terminal of a semiconductor circuit that follows change in the dimension of the chip region while simultaneously measures the semiconductor circuits in a plurality of chip regions on the semiconductor wafer. SOLUTION: A plurality of contact modules are arranged to correspond to a plurality of chip regions defined on a semiconductor wafer. A probe is so supported by each of the contact modules to contact an external connection terminal of a semiconductor circuit formed in the corresponding chip region. A means is provided to adjust position of the probe or a plurality of contact modules, corresponding to movement of the external connection terminal of the semiconductor circuit that follow change in dimension of a plurality of chip regions of the semiconductor wafer. COPYRIGHT: (C)2004,JPO
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