SEMICONDUCTOR WAFER, SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer, a semiconductor chip, and a semiconductor device and its manufacturing method for realizing a high density, low-profile, and high bonding reliability of a bonding pad. SOLUTION: The semiconductor chip is directly mounted on a opposed circuit board 20 by solder paste 22 on a bonding pad 21. The semiconductor device has an input/output terminal 5 for inputting and outputting signal to and from the semiconductor circuit formed on the semiconductor chip, and a first insulation layer 2 formed on a circuit forming surface 1c of the semiconductor chip. The device also has a Cu sputtering layer 8a and Cu plating layers 8b electrically connected to the input/output terminal 5. A second insulation layer 4 is formed so as to cover the Cu plating layers 8b, and a plating layer 10 comprising tin is formed in openings 11. COPYRIGHT: (C)2004,JPO