| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for laminating which enables the dimensional change of a flexible film at laminating to be set at 0.01% or less by laminating the flexible film at a low stress without a strain, further without faults of a bubble, etc., on the designated position of the board with high precision, and a manufacturing method of an electronic circuit board using the laminating method as well. SOLUTION: The flexible film is held on the surface of a flexible face-like body. The flexible film is transferred to a reinforcing plate by simultaneously pressing the flexible face-like body and the flexible film to the reinforcing plate after having made the flexible film face with the reinforcing-plate surface having an organic layer with keeping a constant gap. COPYRIGHT: (C)2004,JPO |
