发明名称 BONDING SHEET HAVING EPOXY RESIN LAYER AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a bonding sheet which can sufficiently improve all properties of adhesion, heat resistance, bending resistance and processability, can enhance versatility and can be suitably used as a wiring material or part in various types of electronic equipment or as a material for aviation/space use, and also to provide a method for manufacturing the sheet. SOLUTION: The bonding sheet having an excellent adhesive property is manufactured by laminating an epoxy resin layer on an adhesive layer. In the technique, the adhesive property can be improved regardless of the material or composition of the adhesive layer. Thus when the adhesive layer is made of, e.g., polyimide, all properties including not only the adhesive property but also heat resistance, bending resistance and processability can be improved. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004072038(A) 申请公布日期 2004.03.04
申请号 JP20020232881 申请日期 2002.08.09
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 KOKAWARA KAORU;OKADA YOSHIFUMI;YAMANAKA TOSHIO
分类号 B32B27/38;C09J7/00;C09J133/06;C09J163/00;C09J179/08;C09J201/00;H01L21/60;H05K3/38;(IPC1-7):H01L21/60 主分类号 B32B27/38
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