| 摘要 |
PROBLEM TO BE SOLVED: To provide a resistive layer laminated material which enables a resistor unit having a desired resistance value to be formed inside a wiring pattern formed by etching, and to provide a component using the same. SOLUTION: The resistive layer laminated material 20 is composed of a conductive plate 26, a polymer plate 24, and a non-alloy resistive layer 25 interposed between the plates 26 and 24. The surfaces to be joined of the conductive plate 26 and the polymer plate 24 are previously subjected to an activation treatment, and then a non-alloy resistive layer is laminated, at least, on either the conductive plate 26 or the polymer plate 24. Thereafter, the conductive plate 26 and the polymer plate 24 are joined with each other so as to interpose the non-alloy resistive layer 25 between them, forming the resistive layer laminated material 20 which enables a resistor unit having a desired resistance value to be formed inside a wiring pattern. A component usable for a printed circuit board, an IC package or the like is manufactured by the use of the resistive layer laminated material 20. COPYRIGHT: (C)2004,JPO
|
