POLISHING PAD AND POLISHING METHOD

摘要

A polishing pad (10) and a polishing method capable of stably polishing the notch of a wafer for a long time without generating dust and without damaging the notch during the polishing, the polishing pad (10) comprising a disk-like pad (11) formed of a synthetic resin such as a foam resin and holding plates (12) fixed to both faces of the pad (11) so that the peripheral edge portion of the pad (11) can be exposed, wherein the cross sectional shape of the peripheral edge portion of the pad (11) is formed so as to be fitted into the notch (21), the pad (11) is formed of a foam body such as a foam urethane, the average air bubble diameter of the foam body comes within the range of 10 to 500 mum, and the hardness thereof comes within the range of 25 to 95 ° in Shore hardness scale A, whereby the notch (21) can be polished by pressingly fitting the peripheral edge portion of the pad (11) into the notch (21) while rotating the polishing pad (10) and feeding slurry to a contact portion between the peripheral edge portion of the pad (11) and the notch (21) through a nozzle (14).