FILM HAVING LOW DIELECTRIC DISSIPATION FACTOR AND WIRING FILM

摘要

PURPOSE: To obtain a film having a low dielectric dissipation factor using a resin composition having a low dielectric dissipation factor containing a polyfunctional styrene compound having excellent dielectric characteristics and a wiring film. CONSTITUTION: The curable film having a low dielectric dissipation factor contains a crosslinking component containing a plurality of styrene groups represented by formula(R is a hydrocarbon skeleton; R¬1s are mutually the same or different and are each hydrogen atom or a 1-20C hydrocarbon group; R¬2, R¬3 and R¬4 are mutually the same or different and are each hydrogen atom or 1-6C alkyl group; m is an integer of 1-4; n is an integer of >=2) and having a <=1,000 weight-average molecular weight and a polymeric substance. The laminate film comprises the film having a low dielectric dissipation factor as an insulating layer.