| 摘要 |
PROBLEM TO BE SOLVED: To accurately conduct position adjustment of a transfer arm 6 in the perpendicular direction in an initial setup by eliminating defective conditions caused by the strain or deformation of a wafer cassette 2 and position deviation of the transfer arm 6. SOLUTION: A face of the side walls of the wafer cassette 2A is an opening OP, to and from where a plate 7 is inputted and outputted. A distance sensor 9 that measures the distance in the perpendicular direction to the plate 7 with a non-contact method is arranged on the inner face of the upper wall 21 of the wafer cassette 2A, while a display unit 10 that displays the measured result of the distance sensor 9 is arranged on the outer face of the upper wall 21 of the wafer cassette 2A. In addition, a battery 11 that serves as a driving power source for the distance sensor 9 and for the display unit 10 is arranged on the inner face of a side wall of the wafer cassette 2A. COPYRIGHT: (C)2004,JPO |
