Signal communication structures

摘要

Signal communication structures and methods for making the same are provided. One embodiment of the present invention comprises a signal communication structure. The structure comprises a signal communication element having a signal communication surface, an integrated circuit chip, and a substrate. A surface of the signal communication element other than the signal communication surface is physically coupled to a surface of the integrated circuit chip. In addition, another surface of the integrated circuit chip is communicatively coupled to the substrate. Furthermore, the size of the signal communication surface is greater than the size of the surface of the integrated circuit chip to which the signal communication element is physically coupled.