发明名称 MULTI-LAYER ANTENNA STRUCTURE
摘要 The invention provides a multi-layer antenna structure for use in a wireless communication system. The antenna may be integrated within a multi-layer circuit structure such as a multi-layer printed circuit board. The multi-layer antenna structure may include, for example, a radiating component and a conductive strip feed-line that electromagnetically couples to the radiating component to directly feed the radiating component. The conductive strip feed-line may be fabricated to form a balun. The conductive strip feed-line may, for example, form a quarter-wavelength open circuit in order to realize the balun. The balun may perform signal transformations, e.g., unbalanced to balanced, as well as impedance transformations. The radiating component and the conductive strip feed-line forming the balun may be formed on different layers of a multi-layer circuit structure.
申请公布号 WO2004019445(A2) 申请公布日期 2004.03.04
申请号 WO2003US21960 申请日期 2003.07.16
申请人 BERMAI, INC. 发明人 SIEGLER II, MICHAEL, J.;SAINATI, ROBERT
分类号 H01Q1/24;H01Q9/28 主分类号 H01Q1/24
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