Triple wafer stack bonding method e.g. for mass production of micromechanical sensors, uses first clamping device for securing 2 stacked wafers prior to aligment of third wafer held by second clamping device

摘要

The bonding method has 2 wafers (1,2) aligned with one another to form a stack and held in a first clamping device (11), with a spacer (12) positioned adjacent the latter before alignment of the third wafer (3) relative to the stacked wafers, with an opening (4) in the third wafer accommodating the first clamping device. The third wafer is held by a second clamping device (21) in the vicinity of the spacer on the opposite side to the stacked wafers. An Independent claim for a bondng device for a triple wafer stack is also included.