发明名称 |
LASER MACHINING APPARATUS, MACHINING METHOD, AND METHOD OF MANUFACTURING CIRCUIT BOARD USING THIS MACHINING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus for machining such as drilling a ceramic green sheet or the like by using a laser beam efficiently. <P>SOLUTION: A plurality of optical path systems are provided between a laser oscillator 1 in the laser machining apparatus and an irradiation position control optical system for irradiating a prescribed position on a work with a laser beam. The plurality of optical path systems 30, 40, i.e. the optical path system 30 for guiding a laser beam to the irradiation position control optical system without changing a cross-sectional shape in a direction perpendicular to an optical axis of the laser beam emitted from the laser oscillator, and the optical system 40 for guiding the laser beam while changing the cross-sectional shape are arranged. These optical path systems are differently used as required, depending on a machining state. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004066327(A) |
申请公布日期 |
2004.03.04 |
申请号 |
JP20020232609 |
申请日期 |
2002.08.09 |
申请人 |
TDK CORP |
发明人 |
AKASAKA AKIRA;ITO TOSHIFUMI;TAKAHASHI KIKUO |
分类号 |
B23K26/00;B23K26/06;B23K26/067;B23K26/073;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/06 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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