发明名称 LASER MACHINING APPARATUS, MACHINING METHOD, AND METHOD OF MANUFACTURING CIRCUIT BOARD USING THIS MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus for machining such as drilling a ceramic green sheet or the like by using a laser beam efficiently. <P>SOLUTION: A plurality of optical path systems are provided between a laser oscillator 1 in the laser machining apparatus and an irradiation position control optical system for irradiating a prescribed position on a work with a laser beam. The plurality of optical path systems 30, 40, i.e. the optical path system 30 for guiding a laser beam to the irradiation position control optical system without changing a cross-sectional shape in a direction perpendicular to an optical axis of the laser beam emitted from the laser oscillator, and the optical system 40 for guiding the laser beam while changing the cross-sectional shape are arranged. These optical path systems are differently used as required, depending on a machining state. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004066327(A) 申请公布日期 2004.03.04
申请号 JP20020232609 申请日期 2002.08.09
申请人 TDK CORP 发明人 AKASAKA AKIRA;ITO TOSHIFUMI;TAKAHASHI KIKUO
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/073;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/06 主分类号 B23K26/00
代理机构 代理人
主权项
地址