发明名称 PACKAGE STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To constitute a package structure which can be sealed up and opened a plurality of times. <P>SOLUTION: The package structure comprises a substrate 12, a connection lead 14 arranged on a main surface of this substrate 12, a sealing frame 16 arranged to enclose a surface of the substrate 12 on the substrate 12 via the connection lead 14, and flat planes which are formed in this sealing frame 16 and can be sealed up and opened a plurality of times by a different sealing lid, e.g., a plurality of step planes 16a, 16b, 17 formed stepwise on a side of an inner wall of a frame member. For this reason, whenever the plane may be sealed up by a new sealing lid, flat parts 16a, 16b, 17 can be used as a new sealing surface, and a contact between the sealing lid and the sealing frame can be made well and resealing can be performed easily and sufficiently. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004071879(A) 申请公布日期 2004.03.04
申请号 JP20020230112 申请日期 2002.08.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 HASUIKE ATSUSHI
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
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