| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To appropriately prevent under cut of a seed layer in a CSP (chip size package) as an electronic device having a rewiring formed by electric plating via the seed layer on a substrate. <P>SOLUTION: The device has a substrate, a rewiring 30 formed on the substrate by electric plating and a conductive seed layer 40 which is formed between an interlaminar film 20 and the rewiring 30 on the substrate and consists of two layers of a first seed layer 41 and a second seed layer 42 from the interlaminar film 20 side. The first seed layer 41 ensures adhesiveness between the interlaminar film 20 at the substrate side and the second seed layer 42. The second seed layer 42 ensures conductivity. The first seed layer 41 forms an island-like structure. <P>COPYRIGHT: (C)2004,JPO</p> |
