| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for bonding a semiconductor wafer to a thermal release tape as an adhesive sheet, cutting off the wafer bonded to the adhesive sheet into individual semiconductor chips, and accurately picking up the individual chips. SOLUTION: A vacuum member 5 is arranged under the semiconductor chip 2A to be picked up to suck the wafer sheet 1 bonded to the rear surface of the chip 2A. After the position of the chip 2A to be picked up is recognized, a heat block 6 for individually heating the chip is moved up to come into contact with the wafer sheet 1, and heats the chip 2A from its rear side. COPYRIGHT: (C)2004,JPO |
