| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing excellent in flame retardance even without containing a halogenous flame retardant and an antimony compound and excellent in moldability, solder resistance, and high-temperature storage characteristics. SOLUTION: This epoxy resin composition for semiconductor sealing is characterized by comprising (A) a phenolaralkyl epoxy resin having a biphenylene skeleton, (B) a phenolaralkyl resin having a biphenylene skeleton, (C) a curing accelerator, (D) an inorganic filler, and (E) a phosphate compound in an amount of 0.05-5 wt.% based on the total amount of the composition. COPYRIGHT: (C)2004,JPO
|
