发明名称 HEAT-SEPARABLE LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive, which possesses excellent elasticity and adhesive strength and, further, specific alkoxysilane-derived improved storage stability, and, can be separated without damage only by heating when an adhesive member is not necessary, and is free from any organic solvent, and to provide a heat-separable laminate using the same. SOLUTION: This adhesive is a heat-separable moisture-curable polymer adhesive, and includes 100 parts by mass of a moisture-curable polymer (A) and 15 to 60 parts by mass of a heat-expandable fine particle hollow body (B). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004066749(A) 申请公布日期 2004.03.04
申请号 JP20020232276 申请日期 2002.08.09
申请人 MATSUSHITA ELECTRIC WORKS LTD;KONISHI CO LTD 发明人 KISHI NOBUO;MAKINO MASAHIKO
分类号 B32B27/00;C09J5/00;C09J127/08;C09J133/20;C09J157/06;C09J171/00;C09J183/04;C09J201/10;(IPC1-7):B32B27/00 主分类号 B32B27/00
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