发明名称 |
Heat-sensitive adhesive material |
摘要 |
A heat-sensitive adhesive material includes a substrate, a heat-sensitive adhesive layer containing a thermoplastic resin and a solid plasticizer formed on the substrate, and a heat-fusible substance capable of depressing the solidifying point of the solid plasticizer in at least one of the heat-sensitive adhesive layer and a layer adjacent to the heat-sensitive adhesive layer. The heat-fusible substance satisfies the following condition (A): E1<E2 where E1 is heat energy to fuse the solid plasticizer; and E2 is heat energy to fuse the heat-fusible substance.
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申请公布号 |
US2004043236(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
US20020229450 |
申请日期 |
2002.08.28 |
申请人 |
KUGO TOMOYUKI;IKEDA TOSHIAKI |
发明人 |
KUGO TOMOYUKI;IKEDA TOSHIAKI |
分类号 |
C09J7/02;C09J11/08;C09J201/00;(IPC1-7):B32B27/00 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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