发明名称 |
Cooling system for use with electronics has circuit board in contact with parallel metal heat conducting filaments on a base |
摘要 |
<p>The heat sink used to cool e.g. an electronic circuit board [41] uses a heat conducting unit [42] that consists of a large number of high conductivity metal filaments. These are sandwiched between the circuit board and a heat conducting base plate [40]. The cooling process is enhanced by blowing cool air over the assembly.</p> |
申请公布号 |
DE20314428(U1) |
申请公布日期 |
2004.03.04 |
申请号 |
DE2003214428U |
申请日期 |
2003.09.17 |
申请人 |
CHEN, JIUNN-LIANG;KUO, YU-YU |
发明人 |
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分类号 |
F28F3/02;H01L23/373;(IPC1-7):F28D21/00;G06F1/20;H01L23/34 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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