发明名称 |
METHOD FOR FORMING BUMP ON ELECTRODE PAD WITH USE OF DOUBLE-LAYERED FILM |
摘要 |
<p>A method for forming a bump on an electrode pad characterized in that at least the following steps (a)-(d) are conducted on a wiring substrate which is composed of a base and a plurality of electrode pads: (a) a step wherein a double-layered film composed of a lower layer made of an alkali-soluble, radiation-nonsensitive resin composition and an upper layer made of a negative, radiation-sensitive resin composition is formed on the wiring substrate, and then an aperture pattern is formed in a corresponding position of the electrode pad; (b) a step wherein a low-melting metal is introduced into the aperture pattern; (c) a step wherein the low-melting metal is reflowed by conducting a press or a heat treatment so as to from a bump, and (d) a step wherein the double-layered film is removed from the substrate. By using the double-layered film having different characteristics, the high-resolution property and the easy-release property become compatible.</p> |
申请公布号 |
WO2004019667(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
WO2003JP10569 |
申请日期 |
2003.08.21 |
申请人 |
JSR CORPORATION;OHTA, MASARU;INOMATA, KATSUMI;IWANAGA, SHINICHIRO |
发明人 |
OHTA, MASARU;INOMATA, KATSUMI;IWANAGA, SHINICHIRO |
分类号 |
G03F7/11;G03F7/40;G03F7/42;H01L21/60;H01L23/12;H05K3/28;H05K3/34;(IPC1-7):H05K3/28 |
主分类号 |
G03F7/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|