发明名称 |
Production of monolithic integrated semiconductor circuit comprises fixing wafer to rigid substrate after preparing component structures with front side surfaces, and further processing |
摘要 |
Production of a monolithic integrated semiconductor circuit comprises fixing a wafer to a rigid substrate (20) after preparing component structures with front side surfaces, processing the substrate to a required thickness, forming holes (28) in the substrate and trenches (27) between the semiconductor circuits and forming a rear side metallization through the holes including the electrical connections, and removing individual semiconductor circuits from the substrate and further processing.
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申请公布号 |
DE10238444(A1) |
申请公布日期 |
2004.03.04 |
申请号 |
DE20021038444 |
申请日期 |
2002.08.22 |
申请人 |
UNITED MONOLITHIC SEMICONDUCTORS GMBH |
发明人 |
BEHAMMER, DAG |
分类号 |
H01L21/301;H01L21/68;H01L21/78;(IPC1-7):H01L21/78 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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