| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compound module and a manufacturing method thereof in which excellent shield characteristics are obtained without providing a connecting hole through a silicon wafer and without using a metal shield case. <P>SOLUTION: A post electrode is formed on a mounting surface of a wafer with an integrated circuit and passive component packaged therein by using a wire or the like, and a mold resin is then applied thereto to perform resin sealing. The wafer is ground from its mounting surface side to expose the post electrode, and an external connecting terminal is formed on the exposed post electrode. <P>COPYRIGHT: (C)2004,JPO |
