发明名称 LIGHT EMITTING DIODE
摘要 <P>PROBLEM TO BE SOLVED: To provide a surface mounting type light emitting diode in which the separation or the like is not generated in a light emitting device, and which is excellent in radiating property so as to sand against the charging of a big current while retaining sufficient reliability, further, constituted of a separate wiring, contracted in the direction of thickness of the light emission diode. <P>SOLUTION: The surface mounting type light emission diode is constituted of a lead electrode 2a, arranged in the recess of a package 1 in parallel to the lengthwise direction of the same and on which light emitting devices 3 are disposed, and a lead electrode 2b for wire bonding, which is arranged at the end of lengthwise direction of the package 1 at the outside of the lead electrode 2a. Respective light emitting devices 3 are disposed on different lead electrodes 2a and the recessed bottom surface 6 of the package 1 consisting of a resin is exposed between respective light emitting devices 3 and respective lead electrodes 2a while being contacted closely to a mold member 5 filled into the recess of the package 1. Further, the light emitting devices 3 are connected to the outside while being electrically independent respectively. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004071675(A) 申请公布日期 2004.03.04
申请号 JP20020225743 申请日期 2002.08.02
申请人 NICHIA CHEM IND LTD 发明人 ISHIDA MASASHI
分类号 H01L23/28;H01L33/32;H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L23/28
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