| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer where short circuit between a projection electrode connected to a mount board and a semiconductor substrate constituting the interposer can be prevented, and to provide a manufacturing method of it, an electronic circuit device using the interposer and a manufacturing method of the device. SOLUTION: When the electronic circuit device where a plurality of semiconductor chips 2 are mounted on the interposer 1 is mounted on the mount board 3, a bump electrode 30 formed in the interposer 1 is deformed. Even if deformation is large, an insulating layer 40 coating a face opposite to the mount board 3 of a silicon substrate 10 is selectively formed by anodization. Thus, the silicon substrate 10 is not brought into direct contact with the bump electrode 30 and the short circuit between the bump electrode 30 and the silicon substrate 10 is avoided. COPYRIGHT: (C)2004,JPO
|
