| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for electronic components which ensures high heat radiation efficiency, prevents peeling of layers and generation of crack in the components due to thermal stress, and enables easier manufacturing. SOLUTION: A linear portion (10) and a folded portion (11) are repeatedly formed zigzag and a plurality of the folded portions (11) are attached to an electronic component. Accordingly, thermal expansion of this electronic component may be absorbed in elastic deformation (α) of the linear portion. COPYRIGHT: (C)2004,JPO
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