| 摘要 |
PROBLEM TO BE SOLVED: To reduce the power consumption of a substrate treating device during the course of substrate treatment and to improve the throughput of the device by increasing the energy efficiency of the heat treating furnace of the device. SOLUTION: In the substrate treating device having a reaction chamber in which substrates are housed and a heating means provided around the reaction chamber, the heating means 14 has a heat insulating layer 16, heating elements 17 provided on the internal surface of the layer 16, and reflecting members 21 on at least the heating elements 17 and the internal surface of the heat insulating layer 16 between the heating elements 17. COPYRIGHT: (C)2004,JPO
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